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Air cooled six heat pipes with high performance 3647-R96 radiator

2020-09-22 10:16:39


Jin Qian Bao recently launched a new tower radiator, very attractive, with six heat pipes, nickel plating, reflow welding and so on, these look very strong feeling.                                                                                                                                                                                                                                                                                                                       

Reflow welding process is adopted

Reflow soldering technology in the field of electronics manufacturing is not strange, we use computer in the various components on the board is welded on the circuit board through this process, the device's internal have a heating circuit, heated to a high enough temperature to air or nitrogen after blowing has good components of circuit boards, components on both sides of the solder melts and motherboard bonding.
The advantage of this process is that the temperature can be controlled easily and oxidation can be avoided during welding.

Adopt complex process flow:

1. The process of reflow welding is surface-mounted board, which can be divided into two types: single-side board and double-side board.
Precoated solder paste → patch (divided into manual paste and automatic paste by machine) → reflow welding → inspection and electrical test.

2. Surface A precoated solder paste → Patch (divided into manual paste and automatic paste by machine) → reflow welding → Surface B precoated solder paste → Patch (divided into manual paste and automatic paste by machine) → reflow welding → inspection and electrical test.

Strict temperature control:

Temperature curve refers to the SMA through the furnace, a point on the SMA temperature curve with time change.
The temperature curve provides an intuitive way to analyze the temperature variation of a component throughout the reflow process.
This is useful for obtaining optimal weldability, avoiding component damage due to overheat, and ensuring welding quality.

In SMT reflow welding process, the reasons for non-uniform heating of components mainly include: the difference of heat capacity or heat absorption of reflow welding components, the influence of conveyor belt or heater edge, and the load of reflow welding products.

1. Generally, PLCC and QFP have larger heat capacity than a discrete chip component, so it is more difficult to weld large-area components than small ones.

2. In the reflow welding furnace, the conveyor belt makes the transferred products reflow welding and also becomes a heat dissipation system. In addition, the edge of the heating part is different from the central heat dissipation condition, and the edge temperature is generally low, so the temperature of the same loading surface is also different in addition to the temperature requirements of each temperature area.

3. The impact of different product loading.
The temperature curve of reflow welding should be adjusted to allow for good repeatability under no load, load and different load factors.
The load factor is defined as: LF=L/(L+S);
Where L= the length of the assembly substrate, S= the interval of the assembly substrate.

The larger the load factor is, the more difficult it is to get good repeatability in reflow welding.
Normally the maximum load factor for reflow soldering ranges from 0.5 to 0.9.
This depends on the product (component welding density, different substrates) and the different type of reflow furnace.
Practical experience is important for good welding performance and repeatability.

Process control:

1. Choose solders with strong adhesive force. The printing accuracy of solders and the mounting accuracy of components also need to be improved.

2. The external electrode of the element needs to have good wetting stability.
Temperature below 400C, humidity below 70%RH, the service life of incoming components should not exceed 6 months.

3. Use small welding zone width size to reduce the surface tension generated on the end of components when solder melts.
In addition, the printing thickness of solder can be reduced appropriately, such as 100um.

4. Welding temperature management condition setting is also a factor for component warping.
The general goal is to heat evenly, especially before the welding fillet is formed at the two ends of the element, without any fluctuation in heating.

With the development of many electronic products towards small, light and high density, especially the use of a large number of handheld devices, the original SMT technology has been severely challenged in the aspect of components and materials technology, thus giving SM the opportunity for rapid development.
With the development of lC pin distance to 0.5mm, 0.4mm and 0.3mm, BGA has been widely adopted, CSP has also emerged and presented a rapid rising trend, and non-cleaning and low-residue solder paste on materials has been widely used.
All of these put forward new requirements for reflow soldering process, and a general trend is to require reflow soldering to adopt more advanced heat transfer mode, achieve energy saving, uniform temperature, suitable for double-panel PCB and new device packaging welding requirements, and gradually realize the overall replacement of wave soldering.

Adopt 6 high performance heat pipes, nickel plating process

1. The stability of nickel plating in the air is very high. Because of the strong passivation ability of nickel, an extremely thin passivation film can be quickly formed on the surface, which can resist the corrosion of atmosphere, alkali and some acids.

2. Electroplating nickel crystal is extremely fine and has excellent polishing performance.
The polished nickel coating gives a mirror-like sheen and retains its luster in the atmosphere for a long time.
Therefore, electroplating is often used for decoration.

3. The hardness of nickel coating is relatively high, which can improve the wear resistance of the product surface. In the printing industry, nickel coating is commonly used to improve the hardness of the lead surface.

4. Metal nickel has high chemical stability

Large area aluminum fin heat dissipation module is adopted


1. The fins on both sides of the radiator body can not only increase the firmness, but also maintain the consistent spacing of each fin, so that the airflow generated by the fan can pass through each fin evenly and smoothly, thus reducing noise and enhancing the heat dissipation performance.

Adopt 9225 high performance fan

The 92*92*25mm cooling fan not only brings strong wind force, but also gives this product higher performance due to its low noise.

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