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Heat pipe AMD SP3-P42 high power radiator

2020-09-22 10:13:49

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       Recently this period of time lifted the mining machine heat, mining machine needs efficient heat dissipation performance, in order to better cool down, Jin Qian Leopard recently launched the new tower radiator, strong fan, 6 heat pipes, let a person at the moment.

                                                               

Reflow welding process is adopted

Reflow soldering technology in the field of electronics manufacturing is not strange, we use computer in the various components on the board is welded on the circuit board through this process, the device's internal have a heating circuit, heated to a high enough temperature to air or nitrogen after blowing has good components of circuit boards, components on both sides of the solder melts and motherboard bonding.
The advantage of this process is that the temperature can be controlled easily and oxidation can be avoided during welding.

Adopt complex process flow:

1. The process of reflow welding is surface-mounted board, which can be divided into two types: single-side board and double-side board.
Precoated solder paste → patch (divided into manual paste and automatic paste by machine) → reflow welding → inspection and electrical test.

2. Surface A precoated solder paste → Patch (divided into manual paste and automatic paste by machine) → reflow welding → Surface B precoated solder paste → Patch (divided into manual paste and automatic paste by machine) → reflow welding → inspection and electrical test.

Strict temperature control:

Temperature curve refers to the SMA through the furnace, a point on the SMA temperature curve with time change.
The temperature curve provides an intuitive way to analyze the temperature variation of a component throughout the reflow process.
This is useful for obtaining optimal weldability, avoiding component damage due to overheat, and ensuring welding quality.

In SMT reflow welding process, the reasons for non-uniform heating of components mainly include: the difference of heat capacity or heat absorption of reflow welding components, the influence of conveyor belt or heater edge, and the load of reflow welding products.

1. Generally, PLCC and QFP have larger heat capacity than a discrete chip component, so it is more difficult to weld large-area components than small ones.

2. In the reflow welding furnace, the conveyor belt makes the transferred products reflow welding and also becomes a heat dissipation system. In addition, the edge of the heating part is different from the central heat dissipation condition, and the edge temperature is generally low, so the temperature of the same loading surface is also different in addition to the temperature requirements of each temperature area.

3. The impact of different product loading.
The temperature curve of reflow welding should be adjusted to allow for good repeatability under no load, load and different load factors.
The load factor is defined as: LF=L/(L+S);
Where L= the length of the assembly substrate, S= the interval of the assembly substrate.

The larger the load factor is, the more difficult it is to get good repeatability in reflow welding.
Normally the maximum load factor for reflow soldering ranges from 0.5 to 0.9.
This depends on the product (component welding density, different substrates) and the different type of reflow furnace.
Practical experience is important for good welding performance and repeatability.

Process control:


1. Choose solders with strong adhesive force. The printing accuracy of solders and the mounting accuracy of components also need to be improved.

2. The external electrode of the element needs to have good wetting stability.
Temperature below 400C, humidity below 70%RH, the service life of incoming components should not exceed 6 months.

3. Use small welding zone width size to reduce the surface tension generated on the end of components when solder melts.
In addition, the printing thickness of solder can be reduced appropriately, such as 100um.

4. Welding temperature management condition setting is also a factor for component warping.
The general goal is to heat evenly, especially before the welding fillet is formed at the two ends of the element, without any fluctuation in heating.

With the development of many electronic products towards small, light and high density, especially the use of a large number of handheld devices, the original SMT technology has been severely challenged in the aspect of components and materials technology, thus giving SM the opportunity for rapid development.
With the development of lC pin distance to 0.5mm, 0.4mm and 0.3mm, BGA has been widely adopted, CSP has also emerged and presented a rapid rising trend, and non-cleaning and low-residue solder paste on materials has been widely used.
All of these put forward new requirements for reflow soldering process, and a general trend is to require reflow soldering to adopt more advanced heat transfer mode, achieve energy saving, uniform temperature, suitable for double-panel PCB and new device packaging welding requirements, and gradually realize the overall replacement of wave soldering.

Adopt 6 high performance heat pipes, nickel plating process


1. The stability of nickel plating in the air is very high. Because of the strong passivation ability of nickel, an extremely thin passivation film can be quickly formed on the surface, which can resist the corrosion of atmosphere, alkali and some acids.

2. Electroplating nickel crystal is extremely fine and has excellent polishing performance.
The polished nickel coating gives a mirror-like sheen and retains its luster in the atmosphere for a long time.
Therefore, electroplating is often used for decoration.

3. The hardness of nickel coating is relatively high, which can improve the wear resistance of the product surface. In the printing industry, nickel coating is commonly used to improve the hardness of the lead surface.

4. Metal nickel has high chemical stability


Electroless nickel plating process is used for aluminum plate



(1) When sodium hypophosphate is used as reducing agent, due to the precipitation of phosphorus, the co-deposition of phosphorus and nickel occurs, so the electroless nickel plating layer is a diffuse nickel-Phosphorus alloy coating, the mass fraction of phosphorus in the coating is 1% ~ L5%, the control of phosphorus content to get a nickel-phosphorus coating compact, no hole, corrosion resistance is far better than nickel plating.
When borohydride or aminobarane is used as reducing agent, the electroless nickel plating layer is nickel-boron alloy coating with boron content of 1% ~ 7%.
Only the coating obtained by using hydrazine as reducing agent is pure nickel layer, which contains more than 99.5% nickel.

(2) High hardness, good wear resistance.
The hardness of the electroless nickel layer is only L60 ~ 180HV, while the hardness of the electroless nickel layer is generally 400 ~ 700HV. After proper heat treatment, it can be further improved to be close to or even exceed the hardness of the chromium coating, so the abrasion resistance is good. What's more, the electroless nickel layer has both good corrosion resistance and abrasion resistance.

(3) high chemical stability, good coating adhesion.
The chemical stability of electroless nickel plating is higher than that of electroless nickel plating in atmosphere and other media.
It has a good combination with ordinary steel, copper and other substrates, and the binding force is not lower than that of the nickel plating layer and substrates.

(4) Due to the different amount of phosphorus (boron) in the electroless nickel plating layer and the different heat treatment process after the plating, the physical and chemical properties of the nickel plating layer, such as hardness, corrosion resistance, abrasion resistance, electromagnetic properties have a variety of changes, is rare in other kinds of plating.
Therefore, the industrial application and process design of electroless nickel plating have the characteristics of diversity and specificity.

Traditionally, electroless plating, as a surface treatment method, belongs to electroplating, which is a kind of electroplating.
However, electroless plating is different from electroplating, mainly because electroless plating does not need extra power, and the operation method is different from electroplating. Its characteristics are as follows:

1 coating thickness uniform, the dispersion degree of chemical plating solution is close to 100%.
Electroless plating itself is a self-catalyzing REDOX process, as long as the catalytic matrix and solution contact can be coated, is almost a copy of the matrix shape, to the degree of profiling, not like electroplating, due to the uneven distribution of power lines caused by uneven coating thickness phenomenon.

The electroless plating can not only be applied on the metal surface, through special activation, sensitization treatment, also can be carried out on the non-metallic surface.

(3) Electroless plating equipment is simple, do not need power and anode, as long as the temperature, pH value process parameters under reasonable conditions, the parts to be immersed in the plating solution.

(4) Electroless plating of the binding force, corrosion resistance is better than electroplating.
Some chemical coatings also have special physicochemical properties.

It has high hardness and good wear resistance, hardness of electroless nickel plating layer after heat treatment reaches Hv1100, the general life of the working mold after nickel plating is increased by more than 3 times.

6, strong corrosion resistance, electroless nickel plating in the acid, alkali, salt, ammonia and seawater medium has a very good corrosion resistance, the corrosion resistance is better than stainless steel.

Adopt 9225 high performance fan

92*92*25mm cooling fan, 3800 RPM high speed brings strong wind, at the same time, low noise also makes this product, give higher performance.



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